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 RECTANGULAR FERRITE CHIP BEADS (HIGH CURRENT) FB SERIES M TYPE
OPERATING TEMP.
K40VJ85C
FEATURES
Y Y Y FBMJ HS HM HL FBMH f 6Ag Power supply units: Large withstand voltage (allowable current: up to 6 A) Resistance to high energy High reliability There are several variations of the FBMJ type HS: For broadband applications HM: For upper MHz range applications HL: For GHz range applications The FBMH type are optimal for circuit designs which require high impedances and large currents to combat radiated noise on power lines, etc.
GHz
APPLICATIONS
Y Y Y YOA YUSB Y Y YDeals with power line radiated and conducted noise. YProvides waveform correction of digital signals and high frequency noise countermeasures in various types of digital equipment. YAutomotive YComputer Peripherals YDifferential transmission line on USB and similar products YMobile devices which require lower power consumption
ORDERING CODE
1
FB
3
J H
4
fLPWghmmi
1608(0603) 2125(0805) 2012(0805) 2016(0806) 3216(1206) 3225(1210) 4516(1806) 4525(1810) 4532(1812) 1.6P0.8 2.0P1.25 2.0P1.25 2.0P1.6 3.2P1.6 3.2P2.5 4.5P1.6 4.5P2.5 4.5P3.2
5
HS HM HL
7
E N M 25L M 30L
8 6
hEi
330 111 132 33 110 1300 T
2
M
9
Q QW
FBMJ3216HS800_TZ
1
1
Type
FB Ferrite bead
2
3
3
4
4
5
5
Material code
HS HM HL 1.6P0.8 2.0P1.25 2.0P1.25 2.0P1.6 3.2P1.6 3.2P2.5 4.5P1.6 4.5P2.5 4.5P3.2
6
7
7
8
9
Product characteristics
J H Standard type High Impedance type
External DimensionsfLPWg hmmi
1608(0603) 2125(0805) 2012(0805) 2016(0806) 3216(1206) 3225(1210) 4516(1806) 4525(1810) 4532(1812)
Impedance Tolerance
E N M 25L M 30L
Refer to impedance curves for material difference
8
Packaging
T Tape&Reel
2
Shape
M Rectangular chip
6
Nominal ImpedancehEi
example 330 111 132 33 110 1300
9
Q
www..com
Standard product QWBlank space
Internal code
www..com
282
www..com
EXTERNAL DIMENSIONS
Type FBMJ1608(0603) FBMJ2125(0805) FBMJ3216(1206) FBMJ4516(1806) FBMH1608(0603) FBMH2012(0805) FBMH2016(0806) FBMH3216(1206) FBMH3225(1210) FBMH4516(1806) FBMH4525(1810) FBMH4532(1812) L 1.6M0.2 f0.063M0.008g 2.0M0.2 f0.079M0.008g 3.2M0.3 f0.126M0.012g 4.5M0.3 f0.177M0.012g 1.6M0.1 f0.063M0.004g 2.0M0.2 f0.079M0.008g 2.0M0.2 f0.079M0.008g 3.2M0.3 f0.126M0.012g 3.2M0.3 f0.126M0.012g 4.5M0.3 f0.177M0.012g 4.5M0.4 f0.177M0.016g 4.5M0.4 f0.177M0.016g W 0.8M0.2 f0.031M0.008g 1.25M0.2 f0.049M0.008g 1.6M0.2 f0.063M0.008g 1.6M0.2 f0.063M0.008g 0.8M0.1 f0.031M0.004g 1.25M0.2 f0.049M0.008g 1.6M0.2 f0.063M0.008g 1.6M0.2 f0.063M0.008g 2.5M0.3 f0.098M0.012g 1.6M0.2 f0.063M0.008g 2.5M0.3 f0.098M0.012g 3.2M0.3 f0.126M0.012g T 0.8M0.2 f0.031M0.008g 0.85M0.2 f0.033M0.008g 1.1M0.2 f0.043M0.008g 1.1M0.2 f0.043M0.008g 0.8M0.1 f0.031M0.004g 0.85M0.2 f0.033M0.008g 1.6M0.2 f0.063M0.008g 1.6M0.2 f0.063M0.008g 2.5M0.3 f0.098M0.012g 1.6M0.2 f0.063M0.008g 2.5M0.3 f0.098M0.012g 3.2M0.3 f0.126M0.012g e 0.3M0.2 f0.012M0.008g 0.5M0.3 f0.020M0.012g 0.5M0.3 f0.020M0.012g 0.5M0.3 f0.020M0.012g 0.3M0.15 f0.012M0.006g 0.5M0.3 f0.020M0.012g 0.5M0.3 f0.020M0.012g 0.5M0.3 f0.020M0.012g 0.5M0.3 f0.020M0.012g 0.5M0.3 f0.020M0.012g 0.9M0.6 f0.035M0.024g 0.9M0.6 f0.035M0.024g UnitDmmfinchg
5
FERRITE PRODUCTS
AVAILABLE MATERIALS
(Standard Type) FBMJ1608 HS-type HM-type
1600 1400 1200 1000 800 600 400 200 0 1
(High impedance Type) FBMH1608 HM-type
1600 1400 1200 1000 800 600 400 200 0 1
HL-type
10
100
1000
10000
10
100
1000
10000
I max=4A FBMJ2125 HS-type
I max=4A HM-type
I max=0.5 3.5A HL-type
600 500 400 300 200 100 0 1
I max=0.9 2.5A FBMH20ZZ
10
100
1000
10000
I max=4 6A FBMJ3216 HS-type
I max=4
6A
I max=2A
I max=1.8 2.7A FBMH32ZZ
HM-type
I max=4 6A FBMJ4516 HS-type
I max=4
6A
I max=2 FBMH45ZZ
3A
HM-type
I max=4 6A
I max=4
6A
I max=1.5 4A
Selection Guide
Part Numbers
Electrical Characteristics
Packaging
Reliability Data
Precautions
P.10
etc
P.284
P.285
P.288
P.290
P.292
283
PART NUMBERS
fStandard Typeg FBMJ1608 -----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------Thickness hmmi (inch) 0.8M0.2 (0.031M0.008)
Impedance Ordering code FBMJ1608HS280NT FBMJ1608HM230NT hEi 28M30% 23M30%
Measuring frequency hMHzi 100
DC Resistance hEimax. 0.007
Rated current hAimax. 4.0
FBMJ2125 -----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------Thickness hmmi (inch)
Impedance Ordering code FBMJ2125HS420-T FBMJ2125HS250NT FBMJ2125HM330-T FBMJ2125HM210NT FBMJ2125HL8R0NT hEi 42M25% 25M30% 33M25% 21M30% 8M30%
Measuring frequency hMHzi
DC Resistance hEimax. 0.008 0.004 0.008 0.004 0.010
Rated current hAimax. 4.0 6.0 4.0 6.0 2.0
100
0.85M0.2 (0.033M0.008)
FBMJ3216 -----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------Thickness hmmi (inch) 1.1M0.2 (0.043M0.008)
Impedance Ordering code FBMJ3216HS800-T FBMJ3216HS480NT FBMJ3216HM600-T FBMJ3216HM380NT hEi 80M25% 48M30% 60M25% 38M30%
Measuring frequency hMHzi
DC Resistance hEimax. 0.010 0.005 0.010 0.005
Rated current hAimax. 4.0 6.0 4.0 6.0
100
FBMJ4516 -----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------Thickness hmmi (inch) 1.1M0.2 (0.043M0.008)
Impedance Ordering code FBMJ4516HS111-T FBMJ4516HS720NT FBMJ4516HM900-T FBMJ4516HM560NT fHigh impedance Typeg hEi 110M25% 72M30% 90M25% 56M30%
Measuring frequency hMHzi
DC Resistance hEimax. 0.014 0.007 0.014 0.007
Rated current hAimax. 4.0 6.0 4.0 6.0
100
Impedance Ordering code FBMH1608HM470-T FBMH1608HM600-T FBMH1608HM101-T FBMH1608HM151-T FBMH1608HM221-T FBMH1608HM331-T FBMH1608HM471-T FBMH1608HM601-T FBMH1608HM102-T FBMH1608HL300-T FBMH1608HL600-T FBMH1608HL121-T FBMH2012HM800-T FBMH2012HM121-T FBMH2012HM221-T FBMH2012HM331-T FBMH2016HM251NT FBMH3216HM501NT FBMH4516HM851NT FBMH3225HM601NT FBMH3225HM102NT FBMH4525HM102NT FBMH4525HM162NT FBMH4532HM681-T FBMH4532HM132-T hEi 47M25% 60M25% 100M25% 150M25% 220M25% 330M25% 470M25% 600M25% 1000M25% 30M25% 60M25% 120M25% 80M25% 120M25% 220M25% 330M25% 250M30% 500M30% 850M30% 600M30% 1000M30% 1000M30% 1600M30% 680M25% 1300M25%
Measuring frequency hMHzi
DC Resistance hEimax. 0.020 0.025 0.035 0.050 0.070 0.130 0.150 0.170 0.450 0.040 0.045 0.13 0.025 0.032 0.060 0.080 0.050 0.070 0.100 0.042 0.100 0.060 0.130 0.028 0.060
Rated current hAimax. 3.5 3.0 2.0 2.0 1.5 0.9 0.7 0.7 0.5 2.5 1.8 0.9 2.7 2.5 2.0 1.8 2.0 2.0 1.5 3.0 2.0 3.0 2.0 4.0 3.0
Thickness hmmi (inch)
0.8M0.1 (0.031M0.004)
100
0.85M0.2 (0.033M0.008)
1.6M0.2 (0.063M0.008)
2.5M0.3 (0.098M0.012) 3.2M0.3 (0.126M0.012)
284
ELECTRICAL CHARACTERISTICS
fStandard Typeg FBMJ1608 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
5
FERRITE PRODUCTS
285
FBMJ2125 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
FBMJ3216 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
ELECTRICAL CHARACTERISTICS
fStandard Typeg FBMJ3216 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
FBMJ4516 ------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
286
ELECTRICAL CHARACTERISTICS
fHigh impedance Typeg
FBMH1608HM470-T
200 180 160 140 120 100 80 60 40 20 0 1 10 100 200 180 160 140 120 100
FBMH1608HM600-T
200 180 160 140 120 100
FBMH1608HM101-T
600
FBMH1608HM151-T
500 400
Z
300
Z R X
1000 10000
80 60 40 20 0 1 10
Z R X
100 1000 10000
80 60 40 20 0 1 10 100
R
200
Z R
X
1000 10000
100 0 1
X
10 100 1000 10000
FBMH1608HM221-T
600 600
FBMH1608HM331-T
1600 1400 1200
FBMH1608HM471-T
1600 1400 1200 1000 800
FBMH1608HM601-T
5
FERRITE PRODUCTS
500 400
500 400
1000 300
Z R
300
Z
R
800 600
Z R
Z R
600 400
200
200
X
100 100
400 200 0 1
X
0 1 10 100 1000 10000 0 1 10 100 1000 10000
X
10 100 1000 10000
200 0 1
X
10 100 1000 10000
FBMH1608HM102-T
1600 1400 1200 1000 300
FBMH1608HL300-T
300
FBMH1608HL600-T
600
FBMH1608HL121-T
250
250 200
500 400
Z
200
R Z
Z R X
800 600
R
150
150
300
X
400 200 0 1
100
Z
R X
100
200
X
50 0 1 100 0 1
50 0 1
10
100
1000
10000
10
100
1000
10000
10
100
1000
10000
10
100
1000
10000
FBMH2012HM800-T
400 350 300 250 200 150 100 50 0 1 400 350 300 250 200 150
FBMH2012HM121-T
400 350 300 250 200
FBMH2012HM221-T
800
FBMH2012HM331-T
Z
600
Z R
400
Z R X
10 100 1000 10000
R
150 100 50 0 1 0 1
Z R X
10 100 1000 10000
100 50 0 1
X
200
X
10
100
1000
10000
10
100
1000
10000
FBMH2016HM251NT
800 800
FBMH3216HM501NT
1200
FBMH4516HM851NT
1200
FBMH3225HM601NT
1000 600 600 800
1000
R Z
800
Z
400 400
R
600 400 200
600
R Z
200
X R X
200
400
Z
X
200
X
10 100 1000
0 1
10
100
1000
0 1
10
100
1000
0 1
10
100
1000
0 1
FBMH3225HM102NT
1200 1800 1600 1400 800 1000
FBMH4525HM102NT
1800 1600 1400 1000 1200
FBMH4525HM162NT
1800 1600 1400 1000
FBMH4532HM681-T
1000
R
600 400 200
1200 800 600
Z
Z
R
800 600 400
Z
R
1200 800 600
Z
X
400
X
200 200 1 10 100 1000 0 1 10 0
X
400 200
R X
0 1
10
100
1000
100
1000
0
1
10
100
1000
FBM4532HM132-T
1800 1600 1400 1000 1200 800
R Z
600 400 200 0 1 10 100 1000
X
287
PACKAGING
1 Type
Standard Quantity Standard Quantity [pcs]
Paper Tape Embossed Tape
3
Taping Dimensions 8mm Paper tapef0.315 inches wideg
1608(0603) 2125(0805) 2012(0805) 2016(0806) 3216(1206) 4516(1806) 3225(1210) 4525(1810) 4532(1812)
4000 4000 4000 EE EE EE EE EE EE
EE EE EE 2000 2000 2000 1000 1000 2000
Type 2 Tape Material FBMJ1608 FBMH1608 f0603g FBMJ2125 FBMH2012 f0805g
Chip Cavity A B
Insertion Pitch Tape Thickness F T 1.1max f0.043maxg 1.1max f0.043maxg UnitDmmfinchg
1.0M0.2 1.8M0.2 4.0M0.2 f0.039M0.008g f0.071M0.008g f0.157M0.008g 1.5M0.2 2.3M0.2 4.0M0.2
f0.059M0.008g f0.091M0.008g f0.157M0.008g
8mm
Embossed tapef0.315 inches wideg
Type FBMH2016 f0806g FBMJ3216 f1206g FBMH3216 f1206g FBMH3225 f1210g
Chip Cavity A 1.8M0.2 1.9M0.2 1.9M0.2 2.8M0.2 B 2.2M0.2 3.5M0.2 3.5M0.2 3.5M0.2
Insertion Pitch Tape Thickness F 4.0M0.2 4.0M0.2 4.0M0.2 4.0M0.2 K T 2.6max 0.6max 1.5max 0.3max 2.6max 0.6max 4.0max 0.6max
f0.071M0.008g f0.087M0.008g f0.157M0.008g f0.102maxg f0.024maxg f0.075M0.008g f0.138M0.008g f0.157M0.008g f0.059maxg f0.012maxg f0.075M0.008g f0.138M0.008g f0.157M0.008g f0.102maxg f0.024maxg f0.110M0.008g f0.138M0.008g f0.157M0.008g f0.157maxg f0.024maxg UnitDmmfinchg
288
PACKAGING
12mm
Embossed tapef0.472 inches wideg
5
Reel size
5
FERRITE PRODUCTS
Type FBMJ4516 f1806g FBMH4516 f1806g FBMH4525 f1810g FBMH4532 f1812g
Chip cavity A 1.9M0.2 1.9M0.2 2.9M0.2 3.6M0.2 B 4.9M0.2 4.9M0.2 4.9M0.2 4.9M0.2
Insertion pitch Tape Thickness F 4.0M0.2 4.0M0.2 4.0M0.2 8.0M0.2 K T Type FBMJ1608 FBMJ2125 FBMJ3216 FBMJ4516 FBMH1608 FBMH2012 FBMH2016 FBMH3216 FBMH3225 FBMH4516 FBMH4525 FBMH4532 EIAJ ETX-7001 1.5max 0.3max 2.6max 0.6max 4.0max 0.6max 4.0max 0.6max
BAhmmi finchg
BBhmmi finchg
Whmmi finchg 9.0M0.3 f0.354M0.012g 13M0.3f0.512M0.012g
f0.075M0.008g f0.193M0.008g f0.157M0.008g f0.059maxg f0.012maxg f0.075M0.008g f0.193M0.008g f0.157M0.008g f0.102maxg f0.024maxg f0.114M0.008g f0.193M0.008g f0.157M0.008g f0.157maxg f0.024maxg f0.142M0.008g f0.193M0.008g f0.315M0.008g f0.157maxg f0.024maxg UnitDmmfinchg
180
J0 K3
60
J1 K0
f7.09 J0 g K0.118
f2.36 J0.039 g K0
9.0M0.3 f0.354M0.012g
13M0.3 f0.512M0.012g 330M2.0f12.99M0.080g 100M1.0f3.94M0.039g 14M2.0f0.551M0.080g
All FBM series items conform to EIAJ ETX-7001 reel width of 9.0mm +/0.3mm except the 4516 type which has a 13.0mm +/-0.3mm reel width. 4 Leader and Blank portion
6
Top tape strength
0.1 arrow as illutrated below.
0.7N
The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the
289
RELIABILITY DATA
1/1
RECTANGULAR FERRITE CHIP BEADSfHIGH CURRENTgFB series M type Item 1.Operating Temperature Range 2.Storage Temperature Range K40 ~ J85C K40 ~ J85C *Note: K5 to J40C in taped packaging Specified Value Test Methods and Remarks
3.Impedance
Within the specified tolerance
Measuring equipment: Impedance analyzer (HP4291A) or its equivalent Measuring frequency: 100M1 MHZ
4. DC Resistance
Within the specified range
Four-terminal method Measuring equipment: Milliohm High-Tester 3226(Hioki Denki) or its equivalent
5.Rated Current 6.Vibration
Within the specified range Appearance: No significant abnormality Impedance change: Within M30% of the initial value According to JIS C 0040. Vibration type: A
5
FERRITE PRODUCTS
Total: 6 hrs
Directions: 2 hrs each in X,Y, and Z directions Frequency range: 10 to 55 to 10Hz(/min.)
Amplitude: 1.5 mm(shall not exceed acceleration 196m/s2 ) Mounting method: Soldering onto PC board 7. Solderability 75% or more of immersed surface of terminal electrode shall be covered with fresh solder. Solder temperature: 230M5C Duration: 4M1 sec. Preconditioning: Immersion into flux. Immersion and Removal speed: 25mm/sec. 8.Resistance to Solder Heat Appearance: No significant abnormality Impedance change: Within M30% of the initial value Preheating: 150C for 3 min. Solder temperature: 260M5C Duration: 10M0.5sec Preconditioning: Immersion into flux. Immersion and Removal speed: 25 mm/sec. Recovery: 2 to 3 hrs of recovery under the standard condition after the test. 9.Thermal Shock Appearance: No significant abnormality Impedance change: Within K10 % of the initial value
J50
According to JIS C 0025. Conditions for 1 cycle Step 1 2 3 4 Temperature(C) K40M3C Room Temperature K85M2C Room Temperature Duration(min.) 30M3 Within 3 30M3 Within 3
Number of cycles: 100 Mounting method: Soldering onto PC board Recovery: 2 to 3 hrs of recovery under the standard condition after the removal from test chamber. 10.Humidity (steady state) Appearances: No significant abnormality Impedance change: Within M30% of the initial value Temperature: 40M2C Humidity: 90 to 95%RH Duration: 500 K 0 hrs Mounting method: Soldering onto PC board Recovery: 2 to 3 hrs of recovery under the standard condition after the removal from test chamber. 11.Loading under Damp Heat Appearance : No significant abnormality Impedance change : Within M30% of the initial value Temperature : 40M2C Humidity : 90 to 95%RH Applied current : Rated current Duration : 500 K
J24 0 J24
hrs
Mounting method : Soldering onto PC board Recovery : 2 to 3hrs of recovery under the standard condition after the removal from test chamber. 12.High Temperature Loading Test Appearance: No significant abnormality Impedance change: Within M30% of the initial value Temperature: 85M2C Duration: 500 K
J24 0
hrs
Applied current: Rated current Mounting method: Soldering onto PC board Recovery: 2 to 3 hrs of recovery under the standard condition after the removal from test chamber. 13.Resistance to Flexure of Substrate No mechanical damage. Warp: 2mm Testing board: Glass epoxy-resin substrate Thickness: 0.8mm
14.Adhesion of Electrode
No separation or indication of separation of electrode.
Applied force: 5N Duration: 10 sec.
Note on standard condition: "standard condition" referred to herein is defined as follows 5 to 35C of temperature, 45 to 85% relative humidity and 86 to 106kPa of air pressure. When there are questions concerning measurement results: In order to provide correlation data, the test shall be conducted under condition of 20M2C of temperature, 60 to 70% relative humidity and 86 to 106kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition."
291
PRECAUTIONS
FBM Type
Stages 1.Circuit Design Operating environment, 1.The products described in this specification are intended for use in general electronic equipment,(office systems, supply equipment, telecommunications measuring Precautions Technical considerations
equipment, and household equipment). They are not intended for use in mission-critical equipment or systems requiring special quality and high reliability (traffic systems, safety equipment, aerospace systems, nuclear control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or damage. For such uses, contact TAIYO YUDEN Sales Department in advance. Rated current 1.Rated current of this product is shown in this catalogue, but please be sure to have the base board designed with adequate inspection in case of the generation of heat becomes high within the rated current range when the base board is in high resistance or in bad heating conditions. 2.PCB Design Land pattern design 1.Please contact any of our offices for a land pattern, and refer to a recommended land pattern of specifications. 3.Considerations for automatic placement Adjustment of mounting machine 1.Excessive impact load should not be imposed on the products when mounting onto the PC boards. 2.Mounting and soldering conditions should be checked beforehand. 4.Soldering Wave soldering 1.Please refer to the specifications in the catalog for a wave soldering. Reflow soldering 1.Please contact any of our offices for a reflow soldering, and refer to the recommended condition specified. Lead free soldering 1.When using products with lead free soldering, we request to use them after confirming of adhesion, temperature of resistance to soldering heat, etc. sufficiently. Preheating when soldering Heating:The temperature difference between soldering and remaining heat should not be greater than 150 . . 1.If products are used beyond the range of the recommended conditions, heat stresses may deformthe products, and consequently degrade the reliability of the products Cooling:The temperature difference between the components and cleaning process should not be greater than 100 Recommended conditions for using a soldering iron Put the soldering iron on the land-pattern. Soldering iron's temperature - Below 350 Duration - 3 seconds or less The soldering iron should not directly touch the inductor. 5.Handling Handling 1.Keep the inductors away from all magnets and magnetic objects. Setting PC boards 1.When setting a chip mounted base board, please make sure that there is no residual stress to the chip by distortion in the board or at screw part. Breakaway PC boards (splitting along perforations) 1.When splitting the PC board after mounting inductors, care should be taken not to give any stresses of deflection or twisting to the board. 2.Board separation should not be done manually, but by using the appropriate devices. Mechanical considerations 1.Please do not give the inductors any excessive mechanical shocks. 6.Storage conditions Storage 1.To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the storage area should be controlled.. Recommended conditions Ambient temperature Humidity 0 40 . Even Below 70% RH 1. Under a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes and deterioration of taping/packaging materials may take place. 1.There is a case to be damaged by a mechanical shock. 1.Planning pattern configurations and the position of products should be carefully performed to minimize stress. 1.There is a case that a characteristic varies with residual stress. 1.There is a case that a characteristic varies with magnetic influence. 1.There is a case that products get damaged by a heat shock. 1.If products are used beyond the range of the recommended conditions, heat stresses may deform the products, and consequently degrade the reliability of the products. 1.When installing products, care should be taken not to apply distortion stress as it may deform the products.
5
FERRITE PRODUCTS
The ambient temperature must be kept below 30
under ideal storage conditions, solderability of products electrodes may decrease as time passes. For this reason, inductors should be used within 6 months from the time of delivery.
293


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